|
Product |
Size |
5’
1.5m |
10’
3.0m |
25’
7.5m |
100’
30.5m |
500’
30.5m |
VacupakTM |
Application |
|
Soder-WickR No Clean SD |
1 .030”/0.8mm |
60-1-5 |
60-1-10 |
|
|
|
SW16015 |
SMD, Micro-Circuits |
|
2 .060”/1.5mm |
60-2-5 |
60-2-10 |
|
|
|
SW16025 |
Small Pads, SMDs |
|
3 .080’/2.0mm |
60-3-5 |
60-3-10 |
|
|
|
SW16035 |
Medium Pads |
|
4 .110”/2.8mm |
60-4-5 |
60-4-10 |
|
|
|
SW16045 |
Large Pads |
|
5 .145”/3.7mm |
60-5-5 |
60-5-10 |
|
|
|
SW16055 |
Terminals |
|
6 .210”/5.3mm |
60-6-5 |
|
|
|
|
|
Large Lugs |
qt8gt0bxhw|00106618884B|master_product|specification|87F0A71E-2442-4425-8D6E-2525293E704C
The wick is fabricated from high density copper strands which are precisely cross braided to eliminate oxygen penetration in the pores and therefore ensure fast and safe de-soldering. The copper ensures optimum heat transfer via braid to the excess solder to quickly melt and suck it without damaging the circuit board.It de-solders 40% faster than the conventional wick because of its high suction capabilities and eliminates residual flux on pcb.
Salient Features include Eliminates residual solder cleaning; Eliminates ionic contamination on the boards; Packaged in Vacuum – Packs and ESD-safe static dissipative bobbins; Minimizes heat damage to the board andRoHS compliance